BIQU MicroProbe V2.0 Auto Bed Leveling Sensor Kit, With Bracket For Ender-3 B1, High Precision Chip, Durable Metal Probe, Compatible With FDM Printers, Optimized Temperature Range | MicroProbe V2.0

High Precision: Offers precise measurements with an accuracy of 0.001mm standard deviation at 24℃ ambient temperature and 60℃ bed temperature, ensuring accurate prints.

Wide Compatibility: Specifically designed for H2 Series Extruders and Ender-3 B1 3D Printer, ensuring seamless integration and optimal performance.

Compact and Lightweight Design: The MicroProbe V2.0 is lightweight, weighing only 6g, and features a compact form factor, minimizing interference with the printing process.

Low Standby Current: Consumes only 3mA of standby current, contributing to energy efficiency and reducing power consumption when not in use.

Durable Construction: Boasts a long lifespan of over 10,000,000 probes, ensuring durability and reliability for extended use.

Optimized Temperature Range: Designed to operate effectively within a working temperature of ≤60℃, ensuring consistent performance even in demanding printing environments.

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Description

MicroProbe V2.0 Specifications

Product Name
Microprobe

Total Weight
6g

Voltage
5V

Standby Current
3mA

Maximum Current
2A

Cable Length
150mm x1, 1000mm x1

Wiring
5 pins, 1.25mm Pitch

Working Temperature
≤60℃

Accuracy
0.001mm Standard Deviation @24℃ Ambient, 60℃ Bed
0.003mm Standard Deviation @60℃ Ambient, 100℃ Bed

Lifespan
10,000,000+

Compatibility
All FDM 3D Printers

Delivered by

Tomorrow, Jul 26

in UAE

We offer express delivery to Dubai, Abu Dhabi, Al Ain, Sharjah, Ajman, Ras Al Khaimah, Fujairah, Umm Al Quwain, UAE for BIQU MicroProbe V2.0 Auto Bed Leveling Sensor Kit, With Bracket For Ender-3 B1, High Precision Chip, Durable Metal Probe, Compatible With FDM Printers, Optimized Temperature Range | MicroProbe V2.0.

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